| COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE | 
| SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE | 
| INTERNAL CONFIGURATION | JUNCTION CONTACT ALL SEMICONDUCTOR DEVICE DIODE | 
| INTERNAL JUNCTION CONFIGURATION | PN ALL SEMICONDUCTOR DEVICE DIODE | 
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR ALL SEMICONDUCTOR DEVICE DIODE | 
| INCLOSURE MATERIAL | GLASS ALL SEMICONDUCTOR DEVICE DIODE | 
| MOUNTING METHOD | TERMINAL ALL SEMICONDUCTOR DEVICE DIODE | 
| TERMINAL LENGTH | 0.187 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE | 
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD ALL SEMICONDUCTOR DEVICE DIODE | 
| OVERALL DIAMETER | 0.232 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE | 
| COMPONENT FUNCTION RELATIONSHIP | MATCHED | 
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |